Shanghai Tongjie Environmental Protection provides semiconductor-grade ultrapure water systems employing a comprehensive process flow: pretreatment + two-stage RO + EDI + polishing mixed bed + terminal ultrafiltration + degassing membrane. The produced water exhibits stable resistivity ≥18.2 MΩ·cm (at 25°C), TOC ≤1 ppb, particulate matter ≤0.05 μm, and dissolved oxygen ≤5 μg/L, fully complying with SEMI F57, ASTM E1-2018, and the first-level ultrapure water standard for the electronics industry. Equipped with 316L EP/PVDF high-purity piping, nitrogen-sealed storage tanks, and AIoT intelligent monitoring systems, these systems serve applications in 8–12-inch wafers, advanced packaging, display panels, photovoltaics, and precision electronics manufacturing.
18.2 MΩ·cm stable output from a dual-stage RO+EDI polishing mixed bed, with TOC ≤2 ppb, metal ions <1 ppt, and particles <0.05 μm.
Guaranteed high purity throughout the process with 316L EP stainless steel (Ra ≤ 0.25 μm), PVDF piping, and nitrogen-sealed double-insurance storage tanks.
Intelligent monitoring with over 40 parameters providing real-time tracking of resistivity, TOC, DO, particulates, silicon, and metal ions 24/7, automatically switching to backup system upon anomalies.
The energy-saving system achieves a recovery rate of ≥85%, with concentrated water reused, resulting in a 30% reduction in energy consumption per ton of water.
Modular skid-mounted design enables rapid factory prefabrication and commissioning, with production operational within 15 days on-site, fully compatible with cleanroom layouts.
Fully compliant. Total organic carbon (TOC) ≤2 ppb, particulate matter ≤0.1 μm, and metal ions <1 ppt, suitable for advanced processes up to 7 nm.
Standard configuration features one active unit and one standby unit with automatic switching, ensuring automatic failover to the backup unit and zero downtime risk.
We offer cleanroom-grade modular units, high-purity piping systems, nitrogen sealing solutions, and customized cleanroom installation packages.
The produced water fully complies with SEMI F57, ASTM E1-2018, and the first-level ultrapure water standard for the electronics industry.
Systems are configured with 316L EP stainless steel with internal surface roughness Ra ≤ 0.25 μm, premium PVDF high-purity piping, and nitrogen-sealed double-insurance vessels.
Thanks to the modular skid-mounted prefabrication design, on-site commissioning is streamlined, enabling operational capability within 15 days of arrival.