18.2 MΩ·cm stable output from a dual-stage RO+EDI polishing mixed bed, with TOC ≤2 ppb, metal ions <1 ppt, and particles <0.05 μm.
316L EP stainless steel (Ra ≤ 0.25 μm), PVDF piping, and nitrogen-sealed double-insurance storage tanks.
Intelligent monitoring with over 40 parameters providing real-time tracking of resistivity, TOC, DO, particulates, silicon, and metal ions 24/7, automatically switching to the backup system upon detection of anomalies.
The energy-saving and cost-reduction system achieves a recovery rate of ≥85%, with concentrated water reused, resulting in a 30% reduction in energy consumption per ton of water.
Cleaning, lithography, etching, and deposition of 8–12-inch wafers.
Bumping, TSV, WLCSP cleaning.
LCD/OLED cleaning, developing, and etching.
Silicon Wafer Cleaning, Cell Manufacturing Process.
Optical Components, Sensors, and Medical Device Cleaning.